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Chemical Mechanical Polishing Slurry – One-stop Solution Chemical mechanical polishing is a key process for achieving global uniformity and flatness of wafers in the IC manufacturing process, and chemical mechanical polishing solutions are the main chemical materials used in the chemical mechanical polishing process. To account for various types of objects to polish, Anji chemical mechanical polishing slurries cover copper slurries, barrier slurries, dielectric (silica-based and ceria-based abrasive particles) slurries, tungsten slurries, slurries for various substrates, functional wet chemicals, and polishing slurries for new materials and new processes. Currently, Anji copper and the barrier layer series of chemical mechanical slurries can satisfy the demands of chip manufacturers in China and have achieved breakthroughs in overseas markets. Other related chemical mechanical polishing slurries are supplied to numerous chip manufacturers in China and abroad, whose specific production scale will be adapted to the needs of clients.
Copper slurries and barrier slurries
Tungsten slurries
Chemical mechanical polishing slurries for dielectric materials
Dielectric (silica-based and ceria-based abrasive particles) slurries
Chemical mechanical polishing slurries for substrate
Polishing slurries for new materials and new processes
Chemical Mechanical Polishing Slurry – One-stop Solution Chemical mechanical polishing is a key process for achieving global uniformity and flatness of wafers in the IC manufacturing process, and chemical mechanical polishing solutions are the main chemical materials used in the chemical mechanical polishing process. To account for various types of objects to polish, Anji chemical mechanical polishing slurries cover copper slurries, barrier slurries, dielectric (silica-based and ceria-based abrasive particles) slurries, tungsten slurries, slurries for various substrates, functional wet chemicals, and polishing slurries for new materials and new processes. Currently, Anji copper and the barrier layer series of chemical mechanical slurries can satisfy the demands of chip manufacturers in China and have achieved breakthroughs in overseas markets. Other related chemical mechanical polishing slurries are supplied to numerous chip manufacturers in China and abroad, whose specific production scale will be adapted to the needs of clients.
For the removal and flattening of copper and copper barrier layers in integrated circuit manufacturing processes. Products have been used in mass production on logic chips etc. Continued development and validation of products for the next technology node.
For the removal and flattening of tungsten in integrated circuit manufacturing processes. Products have been used in mass production on logic chips etc. Continued development and validation of products for use in technology nodes below 28nm.
For the removal and flattening of intermediate electrical materials such as silicon dioxide and silicon nitride in integrated circuit manufacturing processes.
Polishing slurries based on cerium dioxide abrasives have the benefits of high-speed silica removal, high selectivity ratios and high flattening efficiency, which are used for shallow groove isolation in IC manufacturing processes and other polishing processes where high-speed silica removal is required, and a wide range of new products have been developed to meet customer requirements.
For the polishing of silicon substrates and other semiconductor substrate materials. The product line covers silicon rough polishing slurries, silicon finishing slurries, silicon carbide polishing slurries, gallium nitride polishing slurries, etc.
Based on the chemical mechanical polishing slurries technology and product platform, Anji develops chemical mechanical polishing slurries for new technologies and processes according to customers' requirements, including TSV silicon through-hole polishing slurries and hybrid bonding polishing slurries for 3D integration processes, polishing slurries for new materials such as polymers and carbon, many of which are available in mass production.
Functional Wet Electronic Chemicals – The advancement of Technology Functional wet electronic chemicals are formulated to achieve special functions through formulation technology and to meet special process requirements in manufacturing. Anji offers post etches cleaning slurries, post etch residue removers, photoresist strippers for wafer level packaging, and other related products, among which, post CMP cleaning slurries, post etch residue removers, post polishing cleaning slurries have been widely used in the manufacture of integrated circuits on 8-inch and 12-inch wafers.
Post etches cleaning slurries
1.Post etches cleaning slurries for aluminum processes
2.Copper damascene processes
3.Hard mask copper damascene processes
Photoresist strippers
Post polishing cleaning slurries
1.Cleaning after chemical mechanical polishing of copper
2.Cleaning after chemical mechanical polishing of tungsten
3.Cleaning after chemical mechanical polishing of aluminum
4.Cleaning after chemical mechanical polishing of silicon nitride
5.Cleaning after chemical mechanical polishing of new materials
6.Polishing pad cleaning slurries
Etching slurries
Plating slurries
Functional Wet Electronic Chemicals – The advancement of Technology Functional wet electronic chemicals are formulated to achieve special functions through formulation technology and to meet special process requirements in manufacturing. Anji offers post etches cleaning slurries, post etch residue removers, photoresist strippers for wafer level packaging, and other related products, among which, post CMP cleaning slurries, post etch residue removers, post polishing cleaning slurries have been widely used in the manufacture of integrated circuits on 8-inch and 12-inch wafers.
For the removal of residues after dry etching, the post etch cleaning slurries include aluminum processes, copper damascene processes, hard mask copper damascene processes, etc.
With hydroxylamine suppliers supplying safe solutions, Anji offers semi-aqueous aluminum post-etch cleaning slurries and amine-based aluminum post-etch cleaning slurries.
The products are used for the removal of etch residues from the aluminum process of integrated circuits, providing excellent etch residue removal capability at low cost, which is also available in mass production for 8" and 12" logic chips, memory chips, etc.
For the removal of etching residues from copper interconnect damascene processes in integrated circuits. Our products offer excellent etch residue removal, low defects, and low cost.
For IC hard mask copper interconnect damascene process etch residue removal. The products offer high titanium nitride hard mask removal capability, excellent etch residue removal, low defects and low cost, which are available in mass production on 28nm logic chips and continuously validated at 28nm and below technology nodes.
For thick film photoresist removal beyond Moore’s Law, such as Wafer level packaging, MEM, etc. The product has >100-micron photoresist removal capability and is cost effective, which is available in mass production for 8" and 12" wafer level packaging (gold bumps, solder bumps, pillar bumps), MEMS, TSV and other processes.
For effective removal of particles and chemical residues from the polished copper surface to avoid corrosion and reduce defects on the polished wafer surface, Anji products can be applied for post polishing cleaning of copper processes from 130-28nm.
For effective removal of particles and chemical residues from the polished tungsten surface, which prevents tungsten surface corrosion and reduces surface defects on polished wafers.
For effective removal of particles and chemical residues from the polished aluminum surface, which prevents tungsten surface corrosion and reduces surface defects on polished wafers.
For effective removal particles and chemical residues from the polished silicon nitride surface, which prevents tungsten surface corrosion and reduces surface defects on polished wafers.
For new cleaning materials after polishing and reducing surface defects on polished wafers.
For effective removal of by-products from polishing pad, which extends the life span of the pad and reduces surface defects on the polished wafer.
Based on slurries and solid surface treatment technology platforms, Anji offers special process etchants, including high selectivity phosphoric acid, to meet customers' process requirements.
Based on self-independent R&D and collaboration, Anji provides a product line of plating slurries and additives for the IC damascene process and advanced packaging areas.